Same-Size Die-Stacking Options | DDAF, WBC, Spacers
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In […]
Author: Chris Perabo
UL Certification for LINQTAPE Polyimide Tapes
CAPLINQ does work with an independent testing facility who can carry out this the UL Certification, but then CAPLINQ normally requests either a commitment for a certain order quantity (ie. 100 rolls), or that the customer pay for the testing.
Polyimide (Kapton) Film as Release Film in Welding Press
CAPLINQ’s non-adhesive polyimide (Kapton) film – it’s PITN-Series – has been successfully tested as a release film in a welding press that fuses PTFE-coated composite conveyor belting.
Process to remove cured KJR silicone from IC’s (Decapping)
Shin-Etsu KJR silicones are used extensively in the manufacture of ICs, transistors, diodes and other semiconductor devices. KJR-4013E is a flexible, moisture-cure silicone most often used as junction-coating resins in […]
Converting from Gold to Copper Wire
In many cases, customers move from a 25um Au wire to a 20um Au wire to save money. In the case of Au, it’s simple arithmetic, 20um is 20% cheaper […]
CAPLINQ to introduce Copper Foils for Battery, EMI, PCB
CAPLINQ will soon introduce a line of copper foil for shielding under its LINQSTAT brand name. The first product being developed is CFT3A: a 75um (3mil) Copper foil with a […]
Heat Capacity of Epoxy Molding Compound
What is the heat capacity of epoxy mold compounds used in semiconductor assembly? Though this information varies based on many variables, the most critical parameters are the filler loading and […]
Polymer based battery using electrically conductive plastic
We recently received a query whether LINQSTAT electrically conductive plastic will conduct electricity through thickness? Will this electrically conductive plastic be suitable for the manufacture of a polymer based battery? […]
