Liquid Encapsulants VS Molding Compounds
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
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Encapsulants and Underfills
This category supports CAPLINQ Encapsulants and Underfills. These products focus primarily on encapsulation, die attach and semiconductor packaging materials. Therefore, the category delivers news and information designed to engage professionals that have questions or comments concerning the proper use and applications of these products.
Why do we need Reworkable Underfills?
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about […]
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CAPLINQ signs distribution agreement with Henkel in Europe
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HENKEL SEMICONDUCTOR PACKAGING MATERIALS IN EUROPE Amsterdam, The Netherlands (WEBWIRE) – October 10th, 2019 – CAPLINQ Europe BV announced today that it has become Henkel’s […]
