CAPLINQ relocates to new European Headquarters
As a testament to its continued growth, CAPLINQ Europe BV has relocated its European Headquarters. This new, larger location in the Netherlands has more than 1500 sq. meters of office, […]
Epoxy Powder Pinholes – Repairing them in Capacitors, Resistors & Thermistors
Troubleshooting epoxy coating powder pinholes, their probable causes and the corrective actions we should take to eliminate them.
Hongyu Yu joins CAPLINQ as Application & Product Engineer
I am happy to announce that effective June 29th, 2020, Hongyu Yu has joined CAPLINQ as Application and Product Engineer. Working full time out of our new offices in Assendelft, […]
Printable thermal interface gels solve automotive reliability challenge
Customers looking for high-reliability one- and two-component thermal interface gels that can be printed finally have a solution they can count on. Customers are often faced with the challenge of […]
Semi-sintering die-attach paste processing: Air vs Nitrogen vs Vacuum
When it comes to high thermal conductivity die-attach options, an engineer is presented with four basic options: Electrically Conductive Die Attach Pastes Semi-Sintering Die Attach Pastes Silver Sintering Pastes Solder […]
Phase Change Material Pads – When thinner isn’t better
When selecting the right Phase Change Material Pad thickness for your application, thinner isn’t always better As any thermal design engineer knows, all other things being equal, Thermal Interface Materials […]
Arthur Geremia joins CAPLINQ as Sales Engineer
I am happy to announce that effective November 25th, 2019, Arthur da Rocha Geremia has joined CAPLINQ as Sales Engineer. Working full time out of our offices in Heemskerk, Netherlands, […]
Fingerprint sensors market to double by 2024
The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards […]