Redefining Epoxy Mold Compound Shelf-Life
How time and temperature affect spiral flow and viscosity, but not shelf-life When it comes to epoxies and specifically epoxy molding compounds (EMC), end users often mistakenly define the terms […]
Aculon Adhesion Promoter & Primer for Surface Treatments
Primers and promoters are the advanced solutions that offer a support for topcoats while potentially eliminating for sanding or rubbing surfaces. A primer is a substance that is used as […]
When do REACH Consulting Services Make Sense?
Our REACH experts provide the finest approach that helps foreign and domestic suppliers regarding trading in Europe. Planning to get your products or business into Europe? Well, to do so, […]
Reducing import duties: How to determine value of goods
Foreign suppliers looking to import goods into the European Union (EU) are subject to import duty based on a number of factors. One of the factors that affects the duty […]
Applications for Solder spheres
A solder sphere is a ball of solder that ensures the bond between the chip package and the printed circuit board. CAPLINQ takes pride in offering one of the highest […]
Low Stress Dielectric Layers for Wafer Level Packages to Reduce Wafer Warpage and Improve Board-Level Temperature-Cycle Reliability
Abstract This paper presents a negative-tone photoimageable spin-on dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive […]
Effects of time and temperature on molding compounds minimum achievable viscosity
During the transfer molding or injection molding process, the epoxy is exposed to elevated temperatures and pressure. At temperature and under pressure, the epoxy mold compound’s viscosity will drop significantly […]
Anna Rutkowska joins CAPLINQ Europe BV as Business Process Analyst
It gives me great pleasure to welcome Anna Rutkowska, who, effective the 1st of February 2018, will take up the position of Business Process Analyst at CAPLINQ Europe BV and […]